Scintillation detector and method for forming a structured scintillator

ABSTRACT

The proposed group of inventions relates to methods for depositing fluorescent coatings on screens, by which an image is detected and/or converted, in particular, to methods of forming a structured scintillator on the surface of a photodetector intended for the detection of X-ray or gamma radiation, hereinafter referred to as the detected radiation, and to devices for obtaining an X-ray image, or an image obtained by detection of gamma radiation, particularly to devices for X-ray mammography and tomosynthesis. A method for forming a structured scintillator on the surface of a pixelated photodetector, wherein according to embodiment 1, at least one structural element is formed directly on the surface of the photodetector, the material of which is deposited by using a two-axis or a three-axis means for discrete deposition of liquid or heterogeneous substances. According to embodiment 2 of the method of forming a structured scintillator on the surface of a pixelated photodetector, at least one structural element is formed directly on the surface of the photodetector previously segmented with a hydrophobic insulating coating consistent with interpixel insensitive areas so that geometric shapes of depositing the material of the structural element are formed under the action of surface tension forces of the boundary of hydrophobic-hydrophilic areas of the photodetector surface. In addition, the group of inventions includes two embodiments of scintillation detectors. The inventions of the proposed group improve the manufacturability with simultaneous extension of the scope of application.

BACKGROUND OF THE INVENTION

Field of the Invention

The proposed group of inventions relates to methods for depositingluminescent coatings on the screens, using which an image is detectedand/or converted, in particular, to methods of forming a structuredscintillator on the surface of a photodetector intended for detection ofX-ray or gamma radiation, hereinafter referred to as the detectedradiation, as well as to devices for obtaining an X-ray image or animage obtained by detection of gamma radiation, particularly to devicesfor X-ray mammography and tomosynthesis.

Description of Related Art

So-called “flat” visible image detectors, including those formammography, which performs the conversion of X-ray image (“shadow”) ofthe test subject to the electrical signals, are used to constructdigital X-ray detectors. These flat detectors are full-dimensional(array) image sensors with a spatial conversion scale of 1:1.

The photodetector itself has a high sensitivity in the range ofwavelengths of visible light (between about 400 and 700 nm), but usuallyit is X-ray insensitive. Accordingly, the X-ray phosphor coatings orso-called scintillation screens (scintillators) having differentconversion efficiencies and scattering characteristics are used toconvert an X-ray image into a visible image. This screen is physicallyplaced (docked) onto the photodetector, thus forming an“image-to-electrical signal” transformation stack. The signal, in turn,is converted to digital form and transmitted to the processing andrendering.

The essential problem of the “screen-photodetector” stack is an opticalscattering provokes the partial exposure of image areas (pixels) by thelight from adjacent areas. The level of such stray light is defined byfactors such as:

-   -   directional characteristics of the screen luminosity (aperture);    -   distance between the surfaces of the screen and photo detector        in the stack.        Also, an additional reduction in the contrast is caused by        internal re-reflections in the scintillator (screen).

An accurate alignment of the array photodetector structure with ascintillator structure divided into pixel areas of the screen is one ofthe main technically complicated and technologically time-consumingtasks. The equipment needed for the purpose of such an alignment and thevalue of its depreciation significantly increase the cost of the productbuilt on structured phosphor.

In addition, the formation of special partitions in the scintillator isan expensive and extremely high-tech process that requires the use ofexpensive equipment and skilled personnel.

The prior art contains, a detector that has a structured scintillatorand a method for depositing the said scintillator on the surface of thephotodetector using the silk-screen printing method are known(JP2002-139568, CANON KK, G01T1/20, publ. 17.05.02, prototype). Thedisadvantage of this method is that it requires prior manufacture of agrid consistent with the size of the pixels of the photodetector andtherefore a precise alignment procedure during the process of phosphordeposition. This invention actually limits the minimal size of a pixelto be deposited to the photodetector to 150-200 microns corresponding tothe limitation of resolution of the silk-screen process. In general, theprinting methods described in the said patent, are so-called integralones, i.e. aimed to obtain a structural array of the scintillator in asingle cycle without the possibility of formation of each (or a single)element of the structure separately.

SUMMARY OF THE INVENTION

The development of a new method of forming a structured scintillator onthe surface of a pixelated photodetector and a scintillation detectormade using the said method, as well as the improvement inmanufacturability with simultaneous extension is the overall objectiveof the group of inventions and the required technical result to beachieved by using the group of inventions.

The defined tasks and the required technical results are achieved byusing the said group of inventions, that the method (embodiment 1) ofthe formation of the structured scintillator on the surface of thepixelated photodetector, in which, according to the invention, at leastone structural element is formed directly on the surface of thephotodetector the material of which is deposited by use of a two-axis ora three-axis means intended for discrete deposition of liquid orheterogeneous substances. In this case, a means is used comprising atleast one printing head consistent with the structure of thephotodetector pixels, that has a photosensitive area.

According to one aspect, invention has been characterized by theheterogeneous properties of the structural elements in the longitudinaldirection due to the deposition process features.

According to another aspect, the invention has been characterized asfollows the material of each of the structural elements is deposited atleast in a single pass of the printing head or a discrete printingdevice (i.e. the deposition process allows to form a minimal part of theimage separately and not the entire image in one time).

According to third aspect, the invention has been characterized by theamount of material to be deposited controlling, so the scintillationstructural elements are preferably formed on the sensitive area of thepixel, wherein the said material includes at least one phosphorcomposition.

According to another aspect, the invention includes the possibilities ofdeposition the hemispherical, parabolic, cylindrical shape, the shape ofa truncated pyramid and, in general, the piecewise-continuous surface ofthe second or higher order or a combined shape of elements.

According to another aspect, the invention is wherein a printing head isused with a nozzle whose shape is matched with the structure ofphotodetector pixels.

According to another aspect, the invention includes the possibilities ofdeposition of structural elements between pixel sensitive areas that arefurther formed of at least one material that absorbs the detectedradiation.

According to another aspect, the invention is wherein the material thatabsorbs the detected radiation is deposited after forming thescintillation structural elements or the material of the scintillationstructural elements is deposited after forming the structural elementsof the material that absorbs the detected radiation, or the material ofscintillation structural elements and the material that absorbs thedetected radiation are alternately deposited.

According to another aspect, the invention is wherein each structuralelement or at least part thereof is formed separately from the others.

According to another aspect, the invention is wherein the surface of thescintillator, preferably the surface of the structural scintillationelements, is coated with at least one layer of reflective coating.

According to another aspect, the invention is wherein the structuralelements are formed having locally differing optical and physicalparameters across the entire photodetector plane to compensate fornon-linearity and non-uniformity of the sensitivity of the photodetectoroutput signal.

When using the group of inventions, the defined tasks and the requiredtechnical results are also achieved as follows, the scintillationdetector (embodiment 1) comprises at least one photodetector with anarray of pixels, each of which has a photosensitive area, and ascintillator comprising at least one structural element made using theproposed method of the embodiment 1.

When using the group of inventions, the defined tasks and the requiredtechnical results are also achieved due to the application of method(embodiment 2) for forming a structured scintillator on the surface of apixelated photodetector, wherein, according to the invention, at leastone structural element is formed directly on the photodetector surfacethat was previously segmented with a hydrophobic insulating coatingcorresponding to interpixel insensitive areas so that geometric shapesof the deposition of the material of the structural element are formedunder the influence of surface tension on the boundary of thehydrophobic-hydrophilic areas of the photodetector surface.

According to another aspect, the invention is wherein the hydrophilicmaterial is further deposited to sensitive areas of pixels.

According to another aspect, the invention is wherein the material ofthe structural element is deposited by immersing the photodetector inthe said material or by flooding the photodetector surface with the saidmaterial, which provide consistent deposition (sedimentation) of thephosphor material on the surface of the photodetector, or by using atwo-axis or a three-axis means for discrete deposition of liquid orheterogeneous substances, wherein at least one phosphor composition isused as the material of the photodetector element.

According to another aspect, the invention is wherein structuralelements are further formed of at least one material that absorbs thedetected radiation, preferably between pixel sensitive areas, wherein atwo-axis or a three-axis means for discrete deposition of uniform liquidor heterogeneous substances is used for their formation, comprising atleast one printing head matched with the structure of the photodetectorpixels, each of which has a photosensitive area.

According to another aspect, the invention is wherein each structuralelement is formed, or at least a part thereof is formed, separately fromothers.

According to another aspect, the invention is wherein the surface of thescintillator, preferably the surface of coated scintillation structuralelements, is coated with at least one layer of reflective coating.

According to another aspect, the invention is wherein structuralelements are formed having locally differing optical and physicalparameters across the entire photodetector plane to compensate fornon-linearity and non-uniformity of the sensitivity of the photodetectoroutput signal.

When using the group of inventions, the defined tasks and the requiredtechnical results are also achieved by that the scintillation detector(embodiment 2) comprises at least one photodetector with an array ofpixels, each of which has a photosensitive area and a scintillatorcomprising at least one structural element made by the said methodaccording to embodiment 2.

A distinctive feature of the proposed group of inventions is a newmethod of forming a structured scintillator on the surface of apixelated photodetector, wherein, in particular, a two-axis or athree-axis means is used for the discrete deposition of homogeneousliquid or heterogeneous substances for depositing directly to thephotodetector surface the material of at least one structural element ofthe scintillator, which improves the manufacturability of the proposedmethod that allows forming many various designs of the scintillator, thestructural elements of various shapes with a various heterogeneousstructure, as well as depositing and aligning scintillation structureson non-recurrent or different-dimensional photodetector arrays, thussimultaneously extending the scope of its application. The mainadvantage of the proposed method is the possibility of permanentelimination of the need for precise alignment of pixelated scintillatingstructures with the array of photodetectors. The structures of thescintillator and photodetector array are aligned immediately during theformation of the scintillation screen, which allows improving themanufacturability of forming a structured scintillator on the surface ofa pixelated photodetector. The scintillator made using the proposedmethod is made as a structured set of elements isolated from each otherand formed on the surface of the photosensitive area of thephotodetector pixel. Local and isolated placement of each scintillationelement relative to other scintillation elements ensures their opticalseparation at the scintillator level, even on pixels of small size,which in turn prevents ingress of light quanta from one sensitive areaof the photodetector pixel to adjacent one, i.e. allows eliminating theeffect of scattering between adjacent pixels.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a general view of the structure of the scintillator and itsorientation relatively to the photodetector and the source of thedetected radiation.

FIG. 2 shows a fragment of the scintillator element and the optical pathof ray reflections inside it.

FIG. 3 shows a process of forming the structure of the scintillator(bottom-up), where A is the formation of the first phosphor layer; B isthe beginning of deposition of the partition material; C is depositionof the second layer of phosphor and partition materials; D is depositionof the third layer of phosphor and partitions; E is the final form of astructured scintillation coating (cross-section).

FIG. 4 shows various embodiments of shape (A) and composition (B) of thescintillator elements.

FIG. 5 shows the movement of the printing head over the surface of thephotodetector during the deposition of the scintillation material.

FIG. 6 shows a method of forming the structure of the phosphor byseparation of the array photodetector surface into hydrophobic andhydrophilic areas.

FIG. 7 shows a diagram of the formation of the scintillator on asubstrate marked with a hydrophobic grid.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The proposed method according to embodiments 1 and 2 includes processesof the deposition (printing) in a discrete manner, which allows formingeach element of the scintillator structure (or only a single one or agroup) separately. Such a method can be defined as a discrete (ordigital) as one that does not require pre-fabrication of patterns ormasks. One of the main advantages of the proposed method according toembodiments 1 and 2, which improves its manufacturability, is thepossibility of permanent elimination of the necessity of accuratealignment of pixilated scintillating structures with the array ofphotodetectors. The scintillator structure and photodetector array arealigned immediately during the formation of the scintillation screen.

FIG. 1 shows a general view of the structure of the scintillator madeusing the proposed method of embodiment 1 and its orientation withrespect to the detected radiation source 1 and the pixelatedphotodetector 2.

The scintillator according to embodiment 1 comprises a plurality ofscintillation structural elements 3 produced from the material that is aphosphor composition 4. Such a detector has a higher contrast of thedetected image due to the absence of the effect of scattering betweenadjacent pixels of the array photodetector 2 due to the physicalisolation of adjacent pixels (not shown in the drawings) of thephotosensitive area 5 (FIG. 2) at the level of scintillation coating,namely the phosphor 4. Indeed, the light produced by the phosphor 4 willonly reach the area of “its own” pixel and will not reach the adjacentone. The photosensitive area 5 of the array photodetector is located onthe substrate 6 (basis). The scintillator according to embodiment 1 maycontain additional partitions 7 (FIG. 3) made of material that absorbsthe detected radiation and reflects the visible light. The presence ofthe partitions 7 will further contribute to the reflection of the lightproduced by the phosphor 4, (FIG. 2) it will only reach the area of “itsown” pixel (not shown in the drawings) and will not reach the adjacentone, thus further contributing to increasing the contrast of the image.For example, when detecting X-ray or gamma radiation, the partitions 7will contribute to the additional absorption of the correspondingradiation in the interpixel intervals, thus reducing its scattering atthe level of the scintillator as a whole.

To form such a scintillator stack structure according to embodiment 1,an industrial printer of high resolution is used, capable of printingmicrostructures with special ink, for example, ink 8 based on phosphorcomposition and/or ink 9 based on material absorbing the detectedradiation (FIG. 3). These inks are usually made of a polymeric binderand nanoscale materials constituting the active base of a converter ofthe detected radiation into the visible light, and are a suspension orcolloidal solution of a phosphor in a binder.

The process of making the stack according to embodiment 1 consists ofseveral cycles. In the first cycle, specially shaped scintillatorstructures are formed, for example, having truncated pyramid 10,parabolic 11 (FIG. 4A), conical 12, hemisphere 13 shapes or a combinedshape (not shown in the drawings). To fulfill this task, one or morepasses of the printing head 14 (FIG. 3) over the photosensitive area 5of the array photodetector 2 are used.

In the second cycle, the partitions 7 between the pixels (not shown inthe drawings) are formed by ink 9 based on material absorbing thedetected radiation and reflecting the visible radiation. Such partitions7 are also deposited by means of air spray, dispersion or ink jetprinting or similar known discrete methods. Additional absorption of thedetected radiation in interpixel intervals reduces its scattering in theplane of the scintillation screen as a whole.

Depending on the characteristics of the ink, in particular, itsviscosity and process requirements, the first and second cycles, i.e.the steps of depositing scintillation structural elements andpartitions, respectively, may be swapped or performed alternately withthe lamination of appropriate materials. For example, if the viscosityof the phosphor ink 8 is higher than the viscosity of the ink 9 ofpartition material, the phosphor-based ink 8 is fully deposited first,and then the partition ink 9 is deposited (not shown in the drawings).In another case, if the viscosity of the ink 9 is higher than theviscosity of the ink 8, on the contrary, the partition ink 9 is fullydeposited first, and then ink 8 of the scintillation elements isdeposited (not shown in the drawings). If viscosities of both ink 8 and9 are equal, their deposition will alternate (FIG. 3A-E).

In an additional (optional) cycle, a reflective coating is deposited,which in turn may be metal and/or single-layer or multi-layer dielectricone (not shown in the drawings). This coating allows increasing theefficiency of the scintillator by reducing radiation losses of eachscintillating particle as a Lambertian source.

Another possibility to make the said scintillation photodetectoraccording to embodiment 1 is a modification of the discrete depositionof phosphor using a dedicated printer fitted with a profiled printinghead 14 (FIG. 5) having a nozzle die, the shape of which is matched withthe pixel structure 16 of the photodetector for the single-passformation of a structural element 3 or 7. In this case, the head 14 mayhave the position 15 between pixels 17 of the sensitive area 5 of thephotodetector and the position 18 over the pixel 17 of the photodetectorsensitive area 5 (FIG. 5). The position 19, FIG. 5, indicates thedirection of deposition of the phosphor material 8. The direction of thehead movement may be two-axis 20 or three-axis (not shown in thedrawings). The two-axis movement and, respectively, the means are usedfor depositing the scintillator on the flat surface of thephotodetector. The three-axis means is used, respectively, for therelief surfaces. This is due to the fact that when depositing thescintillation structure, the distance between the nozzle printing headand the substrate surface should preferably be fixed. Accordingly, thethree-axis means can maintain this distance while adjusting the positionof the head height according to the surface topography.

In particular, according to embodiment 1 the mean for a discrete liquidprinting with a three-axis motion of the printing head may be used forpreparation of the structural elements by with more accurate control ofthe contact time of a drop of deposited suspension with thephotodetector array plane. The physicochemical properties of the dropsubstance may change a lot because of the peculiarities of dropformation process and flight of the said drop to the deposition plane.In particular, evaporation of the binder as a part of the phosphorcomposition results in a changing of the viscosity of the composition.Therefore, the drop spreading area will change too. The flexibility ofthe deposition process according to embodiment 1 increases greatly dueto the controlling of the print head position along the third axis andexpands the range of the devices applications.

Moreover, due to the adjustment of the ink material dosing, the ink typeand viscosity, as well as velocity of exhaust from the nozzle die, thedesired phosphor profile configuration 21 (FIG. 4B) containing differentphosphor compositions is obtained. FIG. 4B shows the case of threedifferent phosphor compositions deposition.

The second embodiment of the formation of the pixelated structure of thephosphor coating deals with the two or more stage process, during whichthe hydrophobic coating material 22 is deposited between the areas ofindividual photosensitive pixels using the discrete printing method(described above), in order to divide the photosensitive area of thearray photodetector 5 with hydrophobic protective strips 23 into pixelareas (FIG. 6). In this case, an active (photosensitive) areas of thepixels may be coated with a hydrophilic material (not shown in thedrawings). Thereafter, the photodetector is brought into contact withthe phosphor material 8 (phosphor suspension solution), for example, bymeans of immersing or pouring. A component of this solution (phosphor 4)is deposited only on the areas that have not been coated with thehydrophobic substance. Finally, the pixelated structure is immediatelyformed on the entire surface due to various effects of surface tension(such as the formation of water droplets on oil surface), which improvesthe manufacturability with simultaneous extension of the scope ofapplication.

Another important feature of the method for manufacturing of detectorsof penetrating radiation according to embodiment 2 is, the ability tomodify the properties of the scintillator across the depth of phosphorstructure 21, for example, layers with one spectrum (efficiency) ofluminescence can be deposited in the surface (in the direction ofpenetration of X-rays or gamma rays) layers of structured phosphor, andthe layers with another spectrum (efficiency) of luminescence can bedeposited in the deep layers (FIG. 5B). Special X-ray absorbent layerscan be deposited directly on the photodetector array followed bydeposition of luminescent layers.

According to embodiment 2, the variations in the form of individualstructural elements of the phosphor is possible during deposition inorder to optimize the luminous efficiency and minimize consumption ofscintillator material in the process of deposition (FIG. 5A).

According to methods proposed according to embodiments 1 and 2, theproduced “scintillator-photodetector” stack is packaged. The proposedscintillation detector can be connected with the electronic control andprocessing circuits and can be placed in any package (not shown in thedrawings). The scintillation detector can further comprise at least onepower supply unit and/or at least one cooling unit and/or at least oneunit for control and digital data transmission and/or, at least oneanalog data transmission unit, or any conceivable combination thereoffor performing the processing and control of electronic circuits.

As a rule, the precise alignment of the pixels 17 of the photodetector 2with the scintillator structure is one of the most difficult technicalchallenges. The equipment needed for such an alignment and itsdepreciation cost significantly increases the cost of the product basedon structured scintillators. One of the main advantages of the newdesign according to the proposed method of scintillator formation andthe scintillation detector obtained using the proposed method is theability to eliminate permanently the need for precise alignment of a setof the structural elements 3 and 7 with the array of pixels 17 of thephotodetector 2. The set of the structural elements 3, 7 and the arrayof the pixels 17 of the photodetector 1 are aligned immediately duringthe deposition of the structural elements 3, 7.

The proposed method of forming the scintillator and the producedscintillator detector according to embodiments 1 and 2 may findapplication in mammography (intended for the radiological examination ofmammary glands) and x-ray systems, as well as in systems of X-ray andgamma-ray inspection, in high-energy particle detection systems ininstallations intended for research. The application of proposed groupof inventions allows improving the contrast of the registrated imageand, therefore, providing better diagnostic quality of the image. Thepreferred area of application of the group of inventions is mammography.The related fields of application are radiography and fluoroscopy.

The following examples illustrate the manufacturing of variousscintillation structures on the photosensitive surface of aphotodetector in accordance with the method proposed in the claimaccording to embodiments 1 and 2.

Example 1: Deposition of a Spherical and Pyramidal Shapes StructuralElements with Indication of their Characteristics According toEmbodiment 1

To test the possibility of formation of structures having a regulated(controlled) shape we can examine an example of printing on silicon withthe Si3N4 passivation. Printing is carried out on the AerosolJet 300(OptomecInc., USA) printer or another system oriented t the printedelectronics technologies application. The material (phosphor) to bedeposited on silicon is a rare-earth oxide composite (Gd2O3, Y2O3,Tb4O7). The said composite is prepared to form a suspension with abinder similar to polyvinyl alcohol (PVA). The colloidal solution havinga viscosity of 200-300 cP and percentage of phosphor material in thesuspension in the range of 40-60% a. Further, each element of thestructure (e.g. hemispherical one) is formed with a variable time andphase of switching-on of the printing head during it movement over thearea of structure forming. In general, these values, when programmingthe printer, will be as follows:

$\varphi = {\varphi_{0} + \left( {R - \frac{R}{\tan\left( {\arcsin\left( \frac{n}{N} \right)} \right)}} \right)}$$t = {2\left( \frac{R}{\tan\left( {\arcsin\left( \frac{n}{N} \right)} \right)} \right)\text{:}V}$wherein φ is a phase of opening the printing head nozzle, φ₀ is aninitial position of printing a single structure, coinciding with thepixel edge region, N is a number of passes during which the structure isprinted, n is a pass number, R is a radius of the hemisphere to beformed; t is time of printing, V is the printing head movement speed.Preferably, each pass is further preceded by a short (a few seconds orlonger) period of infrared drying of the deposited layer, which isneeded for the polymerization of the binder.

Example 2: Forming of a Heterogeneous Structure of a Spherical andPyramidal Shapes According to Embodiment 1

This example describes the heterogeneous deposition of the phosphorstructural elements on the surface of the photodetector for providingthe better consistency of the parameters of the active layers. Thestructural elements are formed using the same layer-by-layer method asdescribed in Example 1. In this case, the heterogeneity is achieved bychanging the chemical composition or the quantity of binder in thecomposition. Thus, from one layer to another, the physicochemicalproperties of the structural elements will change gradually, forexample, when depositing the first layers, such substances can be addedto the composition that ensure the best adhesion of the composite to thesurface of silicon with a passivation layer of Si3N4. In anotherembodiment, the deep layers of the composite may contain a phosphor witha maximum absorption of X-rays to ensure the protection of thephotodetector silicon integrated circuit itself from stray X-rayirradiation.

Example 3: Example of the Scintillator Formation According to Embodiment2 on the Substrate Marked with a Hydrophobic Grid

The hydrophobic coating is deposited by the method of discrete digitalprinting using the printer described in Example 1. In this case, noparticular change is required as compared with conventional printingheads of commercial liquid printers, since the hydrophobic coatingmaterial itself is a true solution, which can contain nanoscaleparticles. After depositing a structure of dividing strips 23 (FIG. 7),it is possible to proceed to the deposition of the phosphor itself, inthis case under the influence of surface tension, the contact angle of adrop of phosphor liquid composition is significantly reduced. FIG. 7shows a phosphor drop 24 a, when depositing without the hydrophobiccoating, from which the corresponding structural element 4 a (FIG. A) isformed, and shows the drop 24 b, with the borders along the hydrophobiccoating 23, from which the corresponding structural element 4 b (FIG. B)is formed. As a result, the amount of phosphor material that can beretained within the area of a pixel of the array photodetector increasessignificantly. This allows, on the one hand, increasing the thickness ofthe phosphor layer, and on the other hand, obtaining a sharperseparation of the pixels in a structured phosphor layer (FIG. 7, B). Inthe best embodiment of this process, the phosphor is deposited in asingle pass of the printing head.

The deposition of the hydrophilic coating in the areas where thereshould be a luminescent structural element improves the adhesion andeventually the service life of the proposed detector; on the other hand,depositing a hydrophobic coating at the areas of boundaries ofphotosensitive area 5 pixels (FIG. 7B) of the silicon photodetectorarray enables better separation of the structured phosphor areas.

Thus, the structure of the scintillator and the photodetector array isaligned immediately during the formation of the scintillation screen,which improves its manufacturability. The proposed method according toembodiments 1 and 2 allows forming many different designs of thescintillator, structural elements of different shapes and differentheterogeneous structure, to deposit and align the scintillationstructures on non-periodic or different-dimensional photodetectorarrays, thus allowing simultaneous extension of the scope of itsapplication.

The scintillation detector according to embodiments 1 and 2 made usingthe proposed methods, respectively, is a new type of scintillationdetectors, the main feature of said detectors is the high contrast ofthe registered image due to structuring of the scintillator to bedeposited on the surface of the pixelated photodetector using the methodaccording to embodiments 1 or 2. The proposed detector according toembodiments 1 and 2 has an increased contrast of the registered imagedue to the absence of the effect of scattering between adjacent pixelsof the photodetector, which is ensured by the physical isolation ofadjacent sensitive areas in the scintillator layer so the light producedby the scintillation element will reach only the area of “its own” pixeland will not get into the adjacent one.

This group of inventions is not limited to the said embodiments,moreover, it covers various modifications and embodiments within thespirit and scope of the proposed claims.

The invention claimed is:
 1. A method of forming a structuredscintillator on a surface of a pixelated photodetector, the methodcomprising: providing structural elements formed directly on aphotosensitive area of the photodetector surface; depositing ascintillation material of the structural elements by use of a two-axisor a three-axis means comprising at least one printing head separatelyforming a scintillator structure with respect to each pixel of thephotodetector, wherein each pixel has a photosensitive area; andutilizing the two axis or three axis means for discrete deposition ofthe scintillation material to individually form each scintillatorstructure in layers of differing spectrums of luminescence.
 2. Themethod of claim 1, wherein the structural elements are heterogeneous inheight and that heterogeneity is formed during the deposition.
 3. Themethod of claim 1, wherein the scintillation material that forms eachstructural element is deposited with a single pass of the at least oneprinting head.
 4. The method of claim 1, wherein the amount ofscintillation material to be deposited is controlled to provide at leastone of a spherical and pyramidal shape.
 5. The method of claim 1,wherein the structural elements are formed in the sensitive area of apixel in the pixelated photodetector.
 6. The method of claim 5, whereinthe scintillation material contains at least one phosphor composition.7. The method of claim 5, wherein the structural elements are formed,during deposition, in a shape that is at least one of a group includinghemispherical, parabolic, cylindrical shape, and a truncated pyramid,wherein a piece-wise continuous surface of the second or higher order ora combined shape of elements is formed.
 8. The method of claim 5,wherein the structural elements are further formed with at least onematerial that absorbs detected radiation.
 9. The method of claim 8,wherein the material which absorbs the detected radiation is depositedafter forming the structural elements.
 10. The method of claim 8,wherein the scintillation material is deposited after forming thestructural elements which absorb the detected radiation.
 11. The methodof claim 8, wherein the scintillation material and the at least onematerial that absorbs the detected radiation are alternately deposited.12. The method of claim 1, wherein the printing head has a nozzle with ashape matched with the structure of a photodetector pixel.
 13. Themethod of claim 1, wherein each structural element is formed separatelyfrom other structural elements.
 14. The method of claim 1, wherein atleast part of the structural elements is formed separately from otherstructural elements.
 15. The method of claim 1, wherein the surface ofthe scintillator is further coated with at least one layer of reflectivecoating.
 16. The method of claim 1, wherein the structural elements areformed having locally differing optical and physical parameters acrossan entire photodetector plane to compensate for a non-linearity andnon-uniformity of the sensitivity of the photodetector output signal.17. A method of forming a structured scintillator on a surface of apixelated photodetector, the method comprising: forming structuralelements on the surface; and segmenting the surface with a hydrophobiccoating matched to inter-pixel insensitive areas, forming geometricshapes of deposited material with surface tension forces at boundariesof hydrophobic or hydrophilic areas of the surface, wherein thestructural elements are formed from scintillation material to havelayers of differing spectrums of luminescence.
 18. The method of claim17, wherein hydrophilic material is deposited onto sensitive areas ofthe pixels in the pixelated photodetector.
 19. The method of claim 17,wherein at least one phosphor composition is used as the scintillationmaterial of the structural elements of the photodetector.
 20. The methodof claim 17, wherein the scintillation material of the structuralelements is deposited by immersing the photodetector in a colloidalsolution or suspension of phosphor material.
 21. The method of claim 17,wherein the scintillation material of the structural elements isdeposited by using a two-axis or three-axis means for discretedeposition of homogeneous liquid or heterogeneous substances comprisingat least one printing head.
 22. The method of claim 21, wherein the atleast one printing head has a nozzle with a shape matching the structureof a photodetector pixel.
 23. The method of claim 17, wherein thestructural elements are further formed from at least one material thatabsorbs detected radiation.
 24. The method of claim 17, wherein eachstructural element is formed separately from other structural elements.25. The method of claim 17, wherein at least part of the structuralelements is formed separately from other structural elements.
 26. Themethod of claim 17, wherein the surface of the scintillator is furthercoated with at least one layer of reflective coating.
 27. The method ofclaim 17, wherein the structural elements are formed having locallydiffering optical and physical parameters across an entire photodetectorplane to compensate for non-linearity and non-uniformity of asensitivity of the photodetector output signal.